| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of multilayer printed circuit boards by an IVH for manufacturing the multilayer printed circuit boards with higher productivity by a simpler process, and for providing high interlayer bonding strength without causing problems of warp or the like, and also to provide the multilayer printed circuit board manufactured by the manufacturing method. SOLUTION: A manufacturing method of multilayer printed circuit boards stacks: an insulating substrate; a conductive layer circuit provided on one surface of it; a single-sided wiring board substrate having bumps of a conductive material obtained by filling via-holes formed in the insulating substrate with the conductive material; an adhesive sheet layer comprising an adhesive sheet, and having a through hole of a diameter larger than that of the via-hole at a position corresponding to the via-hole; and other wiring board substrates, and collectively lamination presses them so that the bumps are inserted into the through hole. A multilayer printed circuit board is manufactured by the manufacturing method. COPYRIGHT: (C)2006,JPO&NCIPI |
