| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer printed circuit board which can form uniform thickness of a insulating resin layer between wiring layers. SOLUTION: In the method of manufacturing the multilayer printed circuit board by a build up method including a step of forming the insulating resin layer covering the wiring pattern by placing an uncured resin seat on the board in which a circuit pattern is formed, and heating while pushing the seat by the flat surface of the pushing plate, many projections of the height corresponding to the thickness of the above insulating resin layer are arranged in the flat surface of the above pushing plate. The above projection penetrates the above resin seat by the above pushing, and the tip of the projection is brought into contact with the front surface of the above substrate. COPYRIGHT: (C)2006,JPO&NCIPI |
