| 摘要 |
PROBLEM TO BE SOLVED: To provide a conduction method for an ultrathin laminate that minimizes the warp of an ultrathin laminate when driving a rivet through the ultrathin laminate and leaves no through hole. SOLUTION: The conduction method for an ultrathin laminate, which drives a rivet 4 through the ultrathin laminate 2 having a plurality of ultrathin metal pieces and crimps it to establish conduction between the plurality of ultrathin metal pieces, uses a hollow rivet as the rivet 4, and when driving the hollow rivet through the ultrathin laminate 2, presses an upper surface of the ultrathin laminate about the hollow rivet. The ultrathin laminate conduction method alternatively uses a hollow rivet as the rivet, and before driving the rivet through the ultrathin laminate 2 with a stem, presses an upper surface of the ultrathin laminate 2 placed on a punching die 1 about the rivet with a pressure sleeve 3 vertically slidably fitted about the stem. COPYRIGHT: (C)2006,JPO&NCIPI
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