| 摘要 |
PROBLEM TO BE SOLVED: To provide cooling structure suitable for three-dimensional structure for high-density mounting in a simplified composition. SOLUTION: An electronic device 1 of high-density mounting is provided with two or more double-sided mounting circuit board units accumulated by stack structure to the height direction of a mounted semiconductor device 11; a connector 4 which makes electric connection between the double-sided mounting circuit board units at the end of the double-sided mounting circuit board unit, arranged so that at least one side of the two or more of the accumulated double-sided mounting circuit board units may make an opening; and cooling structure established between the semiconductor devices which are disposed opposite to each other by the stack structure, and come into contact with each of the semiconductor devices disposed opposite to each other. At least one of the double-sided mounting circuit board units has a ground layer formed on the substrate surface. The cooling structure has a heat sink 5 extended between the semiconductor devices disposed opposite to each other, and the heat sink coming into contact with semiconductor devices mounted on the same surface as the ground layer has a projection coming into contact with the ground layer. COPYRIGHT: (C)2006,JPO&NCIPI
|
