| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device and a semiconductor substrate capable of identifying any bad chip at a stage after dicing even when the surface of a semiconductor wafer is sealed with resin. SOLUTION: The manufacturing method comprises a process of forming a plurality of semiconductor chips 12 on the semiconductor wafer 10, a process of forming electrodes 18 on any semiconductor chip 12, a process of inspecting each of the plurality of the semiconductor chips 12, a process of forming a bad chip mark 14 on any bad chip 12<SB>NG</SB>among the plurality of the semiconductor chips 12, a process of forming a resin layer 20 having different color from the bad chip mark 14 so as to cover the semiconductor wafer 10, and a process of exposing an upper surface of the bad chip mark 14 from the surface of the resin layer 20 by removing a surface layer part of the resin layer 20. COPYRIGHT: (C)2006,JPO&NCIPI
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