| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring circuit board for fitting chip component which is provided with an electrode land corresponding to a large chip component or a small chip component. SOLUTION: The area of the printed wiring circuit board for fitting chip component 1A is too large for soldering the comparatively small chip component 10. At least a pair of electrode lands 3A of an area in an appropriate size are formed for soldering the comparatively large chip component 20. Solder amount restrictions 4a for restricting a solder amount by solder resist 4 are formed in the electrode lands 3A. When the large chip component 20 is soldered to the electrode lands 3A, solder fillets S in a sufficient state are formed in the electrode lands 3A except for the solder amount restrictions 4a. When the small chip component 10 is soldered to the electrode lands 3A, the solder fillets S in the sufficient state are formed at least between respective component electrodes 22 and the solder amount restrictions 4a. COPYRIGHT: (C)2006,JPO&NCIPI
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