发明名称 |
System and method for photolithography in semiconductor manufacturing |
摘要 |
A method for forming a semiconductor device includes forming a photoresist layer over a substrate and patterning the photoresist layer to form photoresist portions. A second layer is formed over the substrate in areas not covered by the photoresist portions and the photoresist portions are removed. After removing the photoresist portions, the second layer is used to modify the substrate to create at least a portion of the semiconductor device.
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申请公布号 |
US2006172520(A1) |
申请公布日期 |
2006.08.03 |
申请号 |
US20050050312 |
申请日期 |
2005.02.03 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHANG CHING-YU;LIN CHIN-HSIANG;LIN BURN J. |
分类号 |
H01L21/4763;H01L21/3205 |
主分类号 |
H01L21/4763 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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