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发明名称
Method for forming the intermetal dielectric to improve the dimple
摘要
申请公布号
KR100605910(B1)
申请公布日期
2006.08.02
申请号
KR20040114642
申请日期
2004.12.29
申请人
发明人
分类号
H01L21/31
主分类号
H01L21/31
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代理人
主权项
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