Mounting an IC socket securely on a substrate

摘要

A socket 202 carrying an integrated circuit 208 under a heat sink 204 is mounted on a circuit substrate 206 and secured by an attachment elements 212. These elements hold the socket to the substrate with a compressive load isolated from the heat sink, thus protecting the connection between socket and substrate from disruption caused by the weight of the heat sink. A ball grid array (BGA) socket may be used. The integrated circuit may be a field replaceable unit.