Thermally conductive cover with cooling liquid

摘要

Apparatus for cooling a heat producing component 300 including a thermally conductive cover 306 coupled/in contact with the heat producing component via a single interface 308and a cooling liquid 316 in direct contact with the thermally conductive cover. The cover 306 may be a cold plate or a thermal spreader and the component 300 may be a semiconductor die, wherein the cover 306 occupies the same footprint as the component 300. Also claimed is an apparatus with a cold plate and a heat spreader wherein the cold plate has an attachment area and an open area, the attachment area couples the cold plate to the heat spreader and the open area is an aperture to allow cooling liquid to directly contact the heat spreader. Also claimed are methods for cooling heat producing components.