METHOD AND DEVICE FOR PACKAGING A SUBSTRATE

摘要

A package structure and method of packaging for an interferometric modulator. A thin film material (820) is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator.