| 摘要 |
PROBLEM TO BE SOLVED: To preferably restrain increase in chip size and enable easy determination of the presence of cracks. SOLUTION: A semiconductor device comprises a wiring section 35, arranged in the peripheral part of a semiconductor chip 10 with its one end connected to a first power supply 32, a MOS transistor 20 with its source connected to the first power supply, with its drain connected to a second power supply 30, and with its gate connected to the other end of the wiring section, and a resistor 24 with its one end connected to the second power supply and with the other end connected to the gate of the MOS transistor. |
