发明名称 Chip scale image sensor module and fabrication method of the same
摘要 The present invention provides a chip scale image sensor module and the fabrication method of the same which includes an optical filter removing specific wavelength from the light into the image sensor and a glass layer attached to the optical filter to protect a coating layer, forming pad electrodes on the backside thereof. The invention also includes an image sensor attached to the pad electrodes with redistribution pads formed from the pad electrodes in the backside, and solder balls provided on the backside of the image sensor. The invention reduces the size of the module, screens and uses good quality image sensor modules, saving the manufacturing costs, and having advantage in mass production.
申请公布号 EP1686628(A2) 申请公布日期 2006.08.02
申请号 EP20050257576 申请日期 2005.12.09
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 RYU, JIN MUN;SONG, MOON KOOG
分类号 H01L31/0203;H01L23/48;H01L27/14;H01L27/146;H01L31/0224;H04N5/335 主分类号 H01L31/0203
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