发明名称 Integrated package design and method for a radiation sensing device
摘要 A radiation detector ( 10 ) has a base ( 30 ), a frame ( 48 ), a window ( 46 ), and solder layers ( 50, 52 ) formed from a solder pre-form ( 58, 60 ) to define a vacuum chamber ( 56 ). Feedthroughs ( 18, 40, 44 ) penetrate the base ( 30 ) for electrical connection to internal components. A method for sealing the detector ( 10 ) aligns a lower detector assembly ( 62 ), the frame ( 48 ) the window ( 46 ), and the solder pre-forms ( 58, 60 ) in a non-sealed relation within a processing chamber ( 80, 94 ). High temperature and low pressure is imposed, and the getter ( 42 ) is activated by resistive heating imposed by current leads ( 88 ). The window ( 46 ), frame ( 48 ), and lower detector assembly ( 62 ) are then pressed together and sealed by the liquefied solder pre-forms ( 58, 60 ). The method eliminates the need for a seal port, combines several steps within the processing chamber ( 80, 94 ), and eliminates certain prior art cleaning steps.
申请公布号 US7084010(B1) 申请公布日期 2006.08.01
申请号 US20030688708 申请日期 2003.10.17
申请人 RAYTHEON COMPANY 发明人 KENNEDY ADAM M.;BAILEY MICHAEL;MEISSNER EDWARD;DODDS ROBERT K.;VANLUE DAVID
分类号 H01L21/44;H01L23/055;H01L31/0203 主分类号 H01L21/44
代理机构 代理人
主权项
地址