| 摘要 |
The present invention relates to a substrate bonding apparatus, a bonding method and a bonding method for judging of a substrates bonding to improve the efficiency of substrate sticking via a sealing material in a chamber. Solution included: in a vacuum atmosphere, substrates 31 and 32 to be stuck together discharge gas to lower the vacuum in the chamber 1. When the upper and lower substrates 31 and 32 are properly stuck together via the sealing material 6 applied in a frame shape, gas discharged from the substrate surfaces enclosed with the sealing material 6 is not diffused in the chamber, so the pressure in the chamber 1 abruptly falls, so that a high vacuum is produced. For the purpose, a sensor (pressure detector) 12 which detects the vacuum in the chamber 1 is provided in the present invention and a controller 7 finds an inflection point P where the pressure in the chamber 1 abruptly changes to detect the two substrates 31 and 32 being properly stuck together while the sealing material 6 spreads over the entire region. The simple constitution, therefore, eliminates an unnecessary depression fall of the upper substrate 31 during the sticking process to shorten the tact time of the sticking process. |
