发明名称 |
Method for manufacturing semiconductor device packages |
摘要 |
A method for encapsulating an electronic device is provided. The electronic device includes an integrated circuit, a lead frame for supporting the integrated circuit and having peripheral leads integrally formed therewith, and a heat sink thermally coupled to the lead frame. The heat sink includes an extension extending therefrom in a direction towards a corner of the electronic device. The method includes positioning the electronic device within a mold that includes a gate therein that is adjacent to and parallel with the extension. Molten insulative material is injected through the gate and into the mold for encapsulating the integrated circuit, and at least a portion of the lead frame and the heat sink. |
申请公布号 |
US7084003(B2) |
申请公布日期 |
2006.08.01 |
申请号 |
US20020313962 |
申请日期 |
2002.12.06 |
申请人 |
STMICROELECTRONICS S.R.L. |
发明人 |
MAZZOLA MAURO;POINELLI RENATO |
分类号 |
H01L21/44;H01L21/48;H01L21/50;H01L21/56;H01L23/433 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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