Semiconductor Devices Having Plug Contact Holes Extended Downward From The Main Surface Of A Semiconductor Substrate And Methods Of Fabricating Thereof,申请号KR20040012399-传众专利搜索

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发明名称	Semiconductor Devices Having Plug Contact Holes Extended Downward From The Main Surface Of A Semiconductor Substrate And Methods Of Fabricating Thereof
摘要
申请公布号	KR100607174(B1)	申请公布日期	2006.08.01
申请号	KR20040012399	申请日期	2004.02.24
申请人		发明人
分类号	H01L27/108;H01L21/20;H01L21/285;H01L21/60;H01L21/8242	主分类号	H01L27/108
代理机构		代理人
主权项
地址

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