发明名称 |
Method of making semiconductor bonding tools |
摘要 |
Semiconductor wire bonding tools used in the assembly and interconnection of integrated circuits (ICs) are micromolded from a mixture of ultrafine particulate materials mixed with an organic binder. Following extraction of the binder the green bonding tools are sintered during which they undergo isotropic, constant and accurately predetermined shrinkage. Hence semiconductor wire bonding tools can be produced with virtually no limit to miniaturization, thus allowing the fabrication of higher integrated semiconductor products.
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申请公布号 |
US7083757(B2) |
申请公布日期 |
2006.08.01 |
申请号 |
US20020082867 |
申请日期 |
2002.02.18 |
申请人 |
BILLIET ROMAIN L;NGUYEN HANH T |
发明人 |
BILLIET ROMAIN L.;NGUYEN HANH T. |
分类号 |
C04B35/64;B23K35/00;C04B35/119;C04B35/56;C04B35/634;C04B35/638 |
主分类号 |
C04B35/64 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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