发明名称 |
PB-FREE SOLDER-CONNECTED STRUCTURE AND ELECTRONIC DEVICE |
摘要 |
<p>A Pb-free solder-connected structure having a sufficiently large connection strength, featuring an interface that remains stable even after the passage of time, and maintaining sufficient wettability and resistance against whiskers, and an electronic device. Specifically, a Pb-free solder, characterized in that an Sn-Ag-Bi solder which is a representative Pb-free solder is connected to an electrode that has an Sn-Bi layer formed on the surface thereof. Bi concentration in the Sb-Bi layer is preferably 1 to 20 % by weight to obtain a sufficient degree of wettability. When a more reliable joint is required, the Cu layer is formed under the Sn-Bi layer to obtain a connection portion having a sufficiently large interfacial strength.</p> |
申请公布号 |
CA2314116(C) |
申请公布日期 |
2006.08.01 |
申请号 |
CA19982314116 |
申请日期 |
1998.12.09 |
申请人 |
HITACHI, LTD. |
发明人 |
NISHIMURA, ASAO;SOGA, TASAO;NAKATSUKA, TETSUYA;INABA, YOSHIHARU;ISHIDA, TOSHIHARU;SHIMOKAWA, HANAE;OKUDAIRA, HIROAKI |
分类号 |
H01L23/488;B23K1/00;B23K35/00;B23K35/26;C22C13/02;H01L23/50;H05K3/34 |
主分类号 |
H01L23/488 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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