| 摘要 |
An image sensing module includes a base with an image sensor and a lens assembly connected to the base. A plurality of inner legs are located on a stepped portion between the upper hole and a lower hole in the base. The inner legs extend outward to form outer legs so as to be connected to the circuit board. The image sensor is composed of an image sensing chip connected to a glass plate by way of "Flip Chip". The glass plate is supported on the stepped portion and the inner legs on the stepped portion are connected to the wires on the glass plate. The lens assembly secures the image sensor in the upper hole so that the image sensing module is slim and easily to be manufactured.
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