| 摘要 |
A thin-film resin substrate having a first surface provided with a high-frequency electronic circuit and a second unleveled surface opposite the first surface. The second surface has raised portions and recessed portions, and the electronic circuit contains interconnections, at least some of which extend over regions corresponding to the recessed portions of the second surface so as to reinforce mechanical strength of the thin-film resin substrate at the regions corresponding to the recessed portions.
|
