发明名称 Thin film shape memory alloy actuated microrelay
摘要 A microrelay device formed on a silicon substrate wafer for use in opening and closing a current path in a circuit. A pair of electrically conducting latching beams are attached at their proximal ends to terminals on the substrate. Proximal ends of the beams have complementary shapes which releasably fit together to latch the beams and close the circuit. A pair of shape memory alloy actuators are selectively operated to change shapes which bend one of the beams in a direction which latches the distal ends, or bend the other beam to release the distal ends and open the circuit. The microrelay is bistable in its two positions, and power to the actuators is applied only for switching it open or closed.
申请公布号 US7084726(B2) 申请公布日期 2006.08.01
申请号 US20030661035 申请日期 2003.09.15
申请人 TINI ALLOY COMPANY 发明人 GUPTA VIKAS;MARTYNOV VALERY;JOHNSON A DAVID;GALHOTRA VIKAS
分类号 H01H51/22;H01H1/00;H01H61/01 主分类号 H01H51/22
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