| 摘要 |
The invention concerns an arrangement ( 1 ) for inspecting preferably unpatterned wafers, and comprises: a first optical inspection device ( 2 ) for examining reference wafers (R), which operates using image data processing methods and thereby recognizes defects on the reference wafers; a scattered-light measuring instrument ( 3 ) that is calibrated with the reference wafers (R) by defining at least one threshold value for the recognition of defects on wafers (W) to be inspected, and that comprises means ( 6 ) for recording the locations of threshold value exceedances for the wafers (W) to be inspected; and a second optical inspection device ( 4 ) for examination, only at those locations at which a threshold value exceedance is identified, of the wafers (W) to be inspected, which also comprises a classification device. The scattered-light measuring instrument ( 3 ) and the second optical inspection device ( 4 ) are arranged in one production line (P) as sequentially located stations. The first optical inspection device ( 2 ), on the other hand, is arranged outside the production line (P). A corresponding method is also described.
|
