| 摘要 |
Embodiments of the present invention may provide ways and uses for correlating actual wire bonding machine adjustment parameters to inputs needed for FEA simulations in modeling actual wire bonding operations of a specified capillary design and wire bonding machine. Simulations of wire bonding operations using the specified capillary design are performed with a range of inputs (e.g., capillary displacement, wire yield strength) to develop empirical equations relating to the simulations. Actual wire bonding operations are performed using the specified capillary design with ranges of the actual wire bonding machine adjustment parameters, and the results provide empirical equations relating to the actual wire bonding machine adjustment parameters. The empirical equations are combined to provide empirical equations for the simulation inputs as functions of the actual wire bonding machine adjustment parameters. Such equations may aid in performing chip failure analysis and/or may be incorporated into design rules.
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