发明名称 A COOLING SYSTEM FOR AN ELECTRONIC COMPONENT
摘要 A cooling system for an electronic component is provided. The cooling system includes a plurality of thermoelectric elements for placement above a plurality of different areas of the electronic component. The cooling system has a plurality of conductors connected to the thermoelectric elements for providing current to the thermoelectric elements, such that the thermoelectric elements pump heat away from the respective areas. The cooling system has a control apparatus connected to the conductors for controlling current provided to the thermoelectric elements relative to one another based on heat generated at the different areas.
申请公布号 KR20060086376(A) 申请公布日期 2006.07.31
申请号 KR20067008750 申请日期 2006.05.04
申请人 INTEL CORP. 发明人 LEIJA JAVIER;LUCERO CHRISTOPHER
分类号 H01L23/34;G06F1/20;H01L23/38 主分类号 H01L23/34
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