STACK CIRCUIT MEMBER GAP-FILLED PHOTO SENSITIVE POLYMER AND METHOD FOR MANUFACTURING THEREOF
摘要
A stack circuit member may include a first circuit member and a second circuit member. The first and the second circuit members may be electrically and mechanically connected together using a thermocompression bonding method. A photosensitive polymer layer may be interposed between the first circuit member and the second circuit member. A gap fill process and an electrical connection process may be performed at the same time.
申请公布号
KR100609334(B1)
申请公布日期
2006.07.28
申请号
KR20050050501
申请日期
2005.06.13
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
KWON, YONG CHAI;LEE, KANG WOOK;HAN, SEONG IL;MA, KEUM HEE