| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyamide resin composition improved in impact strength of its molding and release property neither causing the lowering of coating film close adhesiveness of its molding nor increase in the mold deposit quantity, and excellent in surface appearance, and a molding obtained by its melt molding. SOLUTION: This polyamide resin composition contains 0.01-1 part by weight boron nitride (B), and 0.01-1.5 parts by weight at least one (C) selected from the group consisting of a silicone compound and a polyethylene wax, to 100 parts by weight polyamide resin (A), and this molding is prepared by melt molding of the resin composition. COPYRIGHT: (C)2006,JPO&NCIPI
|
