| 发明名称 |
Electronic device manufacture |
| 摘要 |
Compositions suitable for use as underfill materials in an integrated circuit assembly are provided. Also provided are methods of preparing integrated circuit assemblies containing certain underfill materials as well as electronic devices containing such integrated circuit assemblies.
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| 申请公布号 |
US2006167174(A1) |
申请公布日期 |
2006.07.27 |
| 申请号 |
US20060387669 |
申请日期 |
2006.03.23 |
| 申请人 |
ROHM AND HAAS ELECTRONIC MATERIAL LLC |
发明人 |
LAMOLA ANGELO A.;BRESE NATHANIEL E. |
| 分类号 |
C08L9/00;C08F222/40;C08F236/04;C08L47/00;C08L83/04;H01L21/50;H01L21/56;H01L23/29;H01L27/01 |
主分类号 |
C08L9/00 |
| 代理机构 |
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代理人 |
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