| 摘要 |
A method may involve mounting a first supporting plate on an active surface of a wafer using an adhesive. A portion of the back surface of the wafer may be backlapped. A second supporting plate may be mounted on the back surface of the wafer using an adhesive. The first supporting plate may be removed from the active surface of the wafer. Conductive bumps may be provided on the active surface. A backlapping process may include a first grinding process, a second grinding process, and a polishing process. The first and the second supporting plates may be fabricated from a solid material. The adhesive may be an ultraviolet cure adhesive or a thermal cure adhesive.
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