发明名称 Light emitting diode and fabricating method thereof
摘要 A light emitting diode and its fabricating method are disclosed. A light emitting diode epitaxy structure is formed on a substrate, and then the light emitting diode epitaxy structure is etched to form a recess. The recess is then filled with a transparent dielectric material. An adhesive layer is utilized to adhere a conductive substrate and the light emitting diode epitaxy structure. Next, the substrate is removed.
申请公布号 US2006163592(A1) 申请公布日期 2006.07.27
申请号 US20050109345 申请日期 2005.04.19
申请人 UNITED EPITAXY COMPANY, LTD. 发明人 TSAI TZONG-LIANG;WEN WAY-JZE;CHIANG CHANG-HAN;CHANG CHIH-SUNG
分类号 H01L29/22 主分类号 H01L29/22
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