发明名称 |
Light emitting diode and fabricating method thereof |
摘要 |
A light emitting diode and its fabricating method are disclosed. A light emitting diode epitaxy structure is formed on a substrate, and then the light emitting diode epitaxy structure is etched to form a recess. The recess is then filled with a transparent dielectric material. An adhesive layer is utilized to adhere a conductive substrate and the light emitting diode epitaxy structure. Next, the substrate is removed.
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申请公布号 |
US2006163592(A1) |
申请公布日期 |
2006.07.27 |
申请号 |
US20050109345 |
申请日期 |
2005.04.19 |
申请人 |
UNITED EPITAXY COMPANY, LTD. |
发明人 |
TSAI TZONG-LIANG;WEN WAY-JZE;CHIANG CHANG-HAN;CHANG CHIH-SUNG |
分类号 |
H01L29/22 |
主分类号 |
H01L29/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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