| 摘要 |
1,026,164. Semi-conductor devices. STANDARD TELEPHONES & CABLES Ltd. July 26, 1963 [July 27, 1962], No. 28975/62. Heading H1K. A semi-conductor device comprises at least two elongated metal members bonded to and separated by a glass or ceramic bead, and a semi-conductor element including at least two zones, one of which is bonded to one of the elongated members and the other connected by a wire bridging the bead to another of the elongated members. In an embodiment, Fig. 2, flat ribbons, or wires with flattened end 1, 2, are embedded in the bead 3. PN diode 4 is mounted as shown with a flying lead connecting one zone to wire 1. In an alternative arrangement the flying lead is connected to wire 1 through a similar PN diode to give a back-to-back arrangement. In a further assembly (Fig. 5, not shown) a transistor is similarly mounted, with its third zone connected by a flying lead to a further embedded wire. Suitable wire materials are iron-nickel-cobalt alloys, aluminium, gold, nickel, silver, platinum and palladium. After the application of a thin coating of silicone resin an encapsulation consisting of ceramic, glass, or a variety of resins with heat conductive fillers such as aluminium and marble, may be moulded or extruded around the assembly. When a ceramic bead is used its faces are metallized and the elongated members butt-jointed to the faces. |
