| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold having a temperature conditioning circuit which realizes a high quality molding method for suppressing the warpage of an optical disk substrate. SOLUTION: Multistage fixed mirror surface core temperature conditioning circuits 32-1 to 32-3 and movable mirror surface core temperature conditioning circuits 33-1 to 33-3 are respectively provided to a fixed mirror surface core 25 and a movable mirror surface core 29, and the distances from the temperature conditioning circuits 32-1 to 32-3 to a cavity 23 are optimized in inner, middle and outer peripheries to equalize the surface temperature distribution of the optical disk after molding and ejection when a fluid is passed through the temperature conditioning grooves which constitute the temperature conditioning circuits 32-1 to 32-3 and 33-1 to 33-3. Accordingly, the optical disk substrate of high quality having no warpage can be produced. COPYRIGHT: (C)2006,JPO&NCIPI |
