发明名称 INFRARED SOLID IMAGING APPARATUS AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To overcome the problem that there is an interfacial trap in an interface with an oxide film surrounding a PN-junction diode, and a noise is generated by generation and recombination of conductive carriers in an infrared solid imaging apparatus for sensing infrared rays using the conventional PN-junction diode. SOLUTION: The infrared solid imaging apparatus has a distribution of a dopant concentration in a semiconductor layer for constituting the PN-junction diode. The conductive carriers flow the semiconductor layer, and are unevenly distributed in the center rather than the periphery of the semiconductor layer. The generation and recombination of the conductive carriers are reduced in the interface between the semiconductor layer and the peripheral semiconductor/oxide film, and the noise is reduced in the PN-junction diode. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006194784(A) 申请公布日期 2006.07.27
申请号 JP20050007977 申请日期 2005.01.14
申请人 MITSUBISHI ELECTRIC CORP 发明人 OTA YASUAKI;UENO MASAFUMI
分类号 G01J1/02;H01L27/14;H01L35/32;H01L35/34;H04N5/33 主分类号 G01J1/02
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