发明名称 Spaced, bumped component structure
摘要 A spaced, bumped component structure including a first plate, a second plate spaced from the first plate by a first gap, a plurality of solder bumps interconnecting the plates and defining the first gap; at least one of the plates having an anomalous section including one of a raised platform and recess for defining a second gap having a different size from the first gap.
申请公布号 US2006163726(A1) 申请公布日期 2006.07.27
申请号 US20050272564 申请日期 2005.11.10
申请人 KIERSE OLIVER;O'DOWD JOHN;WYNNE JOHN;HUNT WILLIAM;HYNES EAMON;MEEHAN PETER 发明人 KIERSE OLIVER;O'DOWD JOHN;WYNNE JOHN;HUNT WILLIAM;HYNES EAMON;MEEHAN PETER
分类号 H01L23/48 主分类号 H01L23/48
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