发明名称 |
Spaced, bumped component structure |
摘要 |
A spaced, bumped component structure including a first plate, a second plate spaced from the first plate by a first gap, a plurality of solder bumps interconnecting the plates and defining the first gap; at least one of the plates having an anomalous section including one of a raised platform and recess for defining a second gap having a different size from the first gap.
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申请公布号 |
US2006163726(A1) |
申请公布日期 |
2006.07.27 |
申请号 |
US20050272564 |
申请日期 |
2005.11.10 |
申请人 |
KIERSE OLIVER;O'DOWD JOHN;WYNNE JOHN;HUNT WILLIAM;HYNES EAMON;MEEHAN PETER |
发明人 |
KIERSE OLIVER;O'DOWD JOHN;WYNNE JOHN;HUNT WILLIAM;HYNES EAMON;MEEHAN PETER |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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