| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for forming a metallic film having superior adhesiveness to a substrate and few irregularities in the interface between itself and the substrate, in a simple process. <P>SOLUTION: The method for forming the metallic film comprises the steps of: (a) introducing a polymer having a functional group which interacts with a catalyst for electroless plating or a precursor thereof and is directly chemically coupled with the substrate, onto the substrate having the irregularities of 500 nm or less on its surface; (b) imparting the catalyst for electroless plating or a precursor thereof to the polymer; and (c) electroless-plating the resultant substrate. Thus formed metallic film has the adhesiveness of 0.2 kN/m or greater to the substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
