发明名称 |
Method and composition for electro-chemical-mechanical polishing |
摘要 |
Methods and compositions for electro-chemical-mechanical polishing (e-CMP) of silicon chip interconnect materials, such as copper, are provided. The methods include the use of compositions according to the invention in combination with pads having various configurations.
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申请公布号 |
US2006163083(A1) |
申请公布日期 |
2006.07.27 |
申请号 |
US20050038236 |
申请日期 |
2005.01.21 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ANDRICACOS PANAYOTIS C.;CANAPERI DONALD F.;COOPER EMANUEL I.;COTTE JOHN M.;DELIGIANNI HARIKLIA;ECONOMIKOS LAERTIS;EDELSTEIN DANIEL C.;FRANZ SILVIA;PRANATHARTHIHARAN BALASUBRAMANIAN;KRISHNAN MAHADEVAIYER;MANSSON ANDREW P.;WALTON ERICK G.;WEST ALAN C.;ANDRICACOS CALIOPI |
分类号 |
B23H3/00 |
主分类号 |
B23H3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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