发明名称 |
Chip-scale monolithic load switch for portable applications |
摘要 |
A chip-scale package houses a monolithic semiconductor die containing first and second lateral metal oxide semiconductor field effect transistors (MOSFETs) formed on a surface of the semiconductor die. The MOSFETs are formed using a lateral double diffused metal oxide semiconductor structure. The first MOSFET has a first conduction terminal coupled to a first package terminal and a second conduction terminal coupled to a second package terminal. The second MOSFET has a first conduction terminal coupled to a control terminal of the first MOSFET, a second conduction terminal coupled to a third package terminal, and a control terminal coupled to a fourth package terminal. A resistor is coupled between the first package terminal and the control terminal of the first MOSFET. A logic level enable signal controls the first MOSFET to enable the second MOSFET to connect a DC voltage from the first package terminal to the second package terminal.
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申请公布号 |
US2006163709(A1) |
申请公布日期 |
2006.07.27 |
申请号 |
US20060336306 |
申请日期 |
2006.01.18 |
申请人 |
ANDERSON SAMUEL J;OKADA DAVID N |
发明人 |
ANDERSON SAMUEL J.;OKADA DAVID N. |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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