| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that reliability is deteriorated when miniaturization is attempted in a conventional surface acoustic wave device. SOLUTION: The surface acoustic wave device is composed so that a surface acoustic wave element 13 is flip-chip mounted to a wiring substrate 11; and the rear face, the side face, and its periphery of the surface acoustic wave element 13 are covered with a resin film 14. Sharpness is eliminated at each corner of the rear face of the surface acoustic wave element 13. Consequently, it is possible to obtain the small surface acoustic wave device excellent in reliability by preventing the resin film 14 from being torn. COPYRIGHT: (C)2006,JPO&NCIPI
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