| 摘要 |
PROBLEM TO BE SOLVED: To maintain the fine pattern of wiring and keep conductivity appropriately in a three-dimensional wiring body for manufacturing a wiring body in which wiring is formed on a base, and to improve the adhesiveness between the wiring and the base. SOLUTION: A wiring pattern 14 is formed by a hydrophobic section 13 and a hydrophilic section 12 whose wettability is higher than that of the hydrophobic section 13 in a mold 11 for forming the three-dimensional wiring body 1 (a). A catalyst 2 is supplied to the hydrophilic section 12 according to difference in the wettability (b). Wiring 3 is formed by electroless plating at the hydrophilic section 12 after the catalyst 2 is fed (c). Resin 4 is injected into the mold 11 after the wiring 3 is formed to perform resin formation to a base (d). The mold 11 is released after the resin 4 is formed (e). Further, wiring 5 is overlappingly formed onto the wiring 3 by electric copper plating. COPYRIGHT: (C)2006,JPO&NCIPI
|
