发明名称 PACKAGE FOR STORING ELECTRONIC COMPONENTS AND ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a package for electronic component storage and an electronic device where electronic components accommodated in the inside can operate normally and stably for a long period of time, by connecting a lead terminal firmly and reliably to a metalized layer. SOLUTION: The package for electronic component storage, wherein two cut sections C-1 and C-2 are formed which counter mutually sandwiching a side wall 2, has a metalized layer 4 which is led out by passing directly under the side wall 2 from the formation region of the cut section C-1 of the internal side of the wall 2 to the formation region of the cut section C-2 of the external surface side. Two or more projection conductors 4c are formed so as to be arranged in a matrix shape on the metallized layer 4a of the external side of the side wall 2 to which the lead terminal 6 is brazed. Since adjacent projection conductors 4c have staggered arrangement structure, two or more projection conductors 4c are formed so that thickness of brazing material 5 can be thickened. Accordingly, the junction strength of the lead terminal 6 can be increased since good meniscus of the brazing material 5 can be formed. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006196672(A) 申请公布日期 2006.07.27
申请号 JP20050006548 申请日期 2005.01.13
申请人 KYOCERA CORP 发明人 HIRASAWA UMI;KIZU SHOJIRO
分类号 H01L23/04 主分类号 H01L23/04
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