发明名称 |
OXIDE TRANSPARENT CONDUCTIVE FILM MATERIAL, Al TRANSPARENT CONDUCTIVE LAMINATED CIRCUIT BOARD EQUIPPED WITH Al INTERCONNECT LINE, AND ITS MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To simplify a method of manufacturing a laminated circuit board equipped with Al interconnect lines by forming a transparent conductive film out of a transparent conductive material containing specific metal. SOLUTION: An amorphous oxide transparent conductive film material is an oxide whose main component is zinc oxide-tin oxide and in which its electromotive force is -0.6 V or below on the basis of an Ag/AgCl standard electrode in a 2.4% water solution of tetramethyl ammonium hydroxide (TMAH) at 30°C. When the transparent conductive film is formed on a transparent board equipped with Al interconnect lines using the above material, the Al interconnect lines are hardly eluted in a developing process carried out by the use of TMAH even when barrier metal etc are not used. Furthermore, the contact resistance of the Al interconnect line to the transparent conductive film can be made small. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2006196616(A) |
申请公布日期 |
2006.07.27 |
申请号 |
JP20050005569 |
申请日期 |
2005.01.12 |
申请人 |
IDEMITSU KOSAN CO LTD |
发明人 |
MATSUZAKI SHIGEO;MATSUBARA MASAHITO;INOUE KAZUYOSHI;TANAKA NOBUO;YANO KIMINORI |
分类号 |
H01L21/768;G02F1/1343;H01L29/786 |
主分类号 |
H01L21/768 |
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