| 摘要 |
Disclosed herein is a double printed circuit board with a solderless connecting structure, which electrically connects an upper board and a lower board of the double printed circuit board without soldering. The double printed circuit board comprises upper and lower boards, each having a hole with a conductive layer formed on an inner surface thereof. A pin is press-fitted through the holes of the upper and lower boards, and has upper and lower compliant portions formed at upper and lower portions of a pin body to electrically connect the upper board and the lower board, respectively. Since the pin comprises the upper and lower compliant portions, the pin can maintain stable connection between circuits of the upper and lower boards while being firmly coupled to the printed circuit boards, and minimize environmental contamination due to lead.
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