发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 <p>A semiconductor device is provided with a semiconductor substrate (200); ONO films (210, 212, 216) formed on the semiconductor substrate; a control gate (280) on the ONO films; first low resistance layers (250); and second low resistance layers (252) which are brought into contact with the first low resistance layers and are consecutively formed in a current flowing direction. The second low resistance layers have a smaller sheet resistance than that of the first low resistance layers. Thus, the semiconductor device wherein resistance of a bit line is prevented from becoming high, a memory cell can be microminiaturized, and the peripheral circuit manufacturing process is easy, and a method for manufacturing such semiconductor device are provided.</p>
申请公布号 WO2006077650(A1) 申请公布日期 2006.07.27
申请号 WO2005JP00875 申请日期 2005.01.24
申请人 SPANSION LLC;SPANSION JAPAN LIMITED;KOUKETSU, HIROAKI;HOSAKA, MASAYA 发明人 KOUKETSU, HIROAKI;HOSAKA, MASAYA
分类号 H01L21/8247;H01L27/115;H01L29/792 主分类号 H01L21/8247
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