| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flexible electronic component packaging structure with high reliability which suppresses the occurrence of warpages. <P>SOLUTION: An electronic component packaging structure comprises insulating layers 12 and 14 functioning as flexible substrates, an electronic component 20 which is embedded in the insulating layers 12 and 14 so that the whole of the electronic component 20 is covered with the insulating layers 12 and 14, and a wiring layer 16 which is embedded in the insulating layers 12 and 14 and is electrically connected to a connection pad 20a of the electronic component 20. The packaging structure may have a structure, in which a plurality of electronic components are embedded in insulating layers and which is folded to electrically connect the electronic components mutually. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
