CONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a conductor substrate which is useful particularly in production of a seal type semiconductor device, capable of sufficiently withstanding stresses caused by evaporation and inflation of water, and excellent in adhesivity to seal resin.

SOLUTION: In a conductor substrate 1 for mounting a semiconductor element 5, at least a portion thereof mounting the semiconductor element is sealed with insulating resin 9, an uppermost surface layer of the conductor substrate is formed of copper or an alloy thereof, and the conductor substrate is partly or entirely covered with a film 2 of a copper oxide containing hydroxide formed on the surface treatment of the conductor substrate.

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