| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding liquid for a wire saw and an ingot cutting method capable of cutting a wafer having uniform thickness while the warp of the cut wafer is suppressed. SOLUTION: The grinding liquid for the wire saw for use in cutting a mono-crystal ingot comprises at least water or oil as the major component, and to the grinding liquid, a heat-absorbing reaction material turned in the micro-capsule form is added. The cutting method for ingot works with this grinding liquid. COPYRIGHT: (C)2006,JPO&NCIPI |
