| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board (mother board, board mounting semiconductor chip) having excellent electrolytic corrosion-proof property even when L/S=20μm/20μm or less, namely the maximum wiring width M is 20μm or less, and also to provide a method of manufacturing the same. SOLUTION: In the wiring board including the wiring where the maximum wiring width is M, bottom width of wiring is (b), height up to the maximum wiring width from the bottom of wiring is (y) and height of wiring up to the top from the bottom of wiring is (t) and an insulating layer where a wiring is formed, the wiring satisfying the conditions of 0.1≤b/M<1 and 0.1≤y/t≤0.9 is provided. COPYRIGHT: (C)2006,JPO&NCIPI |
