| 摘要 |
Lens member (55) is bonded via transparent adhesive resin (41) to leadframe (36), and is not transfer molded by means of sealing member (37). In this construction, the transparent adhesive resin (41) can be utilized as a buffer member for any thermal stress attributed to a difference of linear expansion coefficient between the leadframe (36) and the lens member (55). By the use of a resin of low Young's modulus, such as a silicic resin, any thermal stress on the lens member (55) can be substantially reduced to thereby prevent any damaging or deformation of the lens member (55). Further, by the addition of a filler to the sealing member (37), the linear expansion coefficient thereof can be lowered so as to enable use in an environment of wide temperature range, for example, from -40° to 115°C. |
