POLISHING PAD

摘要

PROBLEM TO BE SOLVED: To provide a polishing pad which is excellent in durability and polishing property, where falling out of a semiconductor wafer or breakage of the polishing pad is prevented and a smooth polishing process is carried out by preventing exfoliation of a pad peripheral end part from a polishing plate and exfoliation of a polishing layer and a cushion layer for a long period in the case of polishing or dressing.

SOLUTION: The polishing pad used for chemical and mechanical polishing characteristically comprises a low order outer periphery whose height is lower than a polishing surface at the pad peripheral end.

COPYRIGHT: (C)2006,JPO&NCIPI