| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure for mounting a shielding case in order to prevent entry of dusts and solder flux into the shielding case. SOLUTION: It is no longer required to provide a space for fixing the shielding case 58 to the surface 42B of a substrate 42, namely a space to form solder lands by soldering a pawl 66 to the solder lands formed on the surface 42B of the substrate 42 (surface in the opposite side of the surface where an electronic component 56 is mounted). Accordingly, the substrate 42 can be reduced in size. Moreover, the solder land may be formed in the sufficient size by forming the solder lands to the rear surface 42A of the substrate 42. Therefore, mounting strength can be enhanced when the shielding case 58 is fixed to the substrate 42. Moreover, since solder dust and flux generated in the soldering work splash to the rear surface side of the substrate 42, such solder dust and flux do not enter the gap between the shielding case 58 and the substrate 42. COPYRIGHT: (C)2006,JPO&NCIPI |
